Industry News - Engineering.com https://www.engineering.com/category/industry/industry-news/ Mon, 24 Feb 2025 09:29:16 +0000 en-US hourly 1 https://wordpress.org/?v=6.7.2 https://www.engineering.com/wp-content/uploads/2024/06/0-Square-Icon-White-on-Purplea-150x150.png Industry News - Engineering.com https://www.engineering.com/category/industry/industry-news/ 32 32 Leica, Southern California Institute of Architecture Partner to Provide Training https://www.engineering.com/leica-southern-california-institute-of-architecture-partner-to-provide-training/ Mon, 24 Feb 2025 09:28:00 +0000 https://www.engineering.com/?p=136985 The new partnership offers postgraduate scholarships and access to over $200K in technology donations.

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LOS ANGELES, CA,  Feb 24, 2025 – Leica Geosystems, part of Hexagon, announced a new partnership with the Southern California Institute of Architecture (SCI-Arc), created to help train the next generation of architects. The partnership will enable students and faculty at SCI-Arc to experiment with advanced, user-friendly laser-scanning hardware and software, offering hands-on experience with intuitive reality capture solutions that will shape the future of architecture, landscape architecture, urban planning and design, media-based art and more.

Views of Planet City.

“Architects are increasingly leveraging new technologies to create immersive projects, which means that students need to have access to innovative solutions to stay ahead of the curve,” said Fabio Ponzio, executive vice president at Leica Geosystems. “SCI-Arc has earned a reputation for preparing students for any eventuality, and we are honored to work alongside such inventive thinkers. Together, we can drive transformative progress in the media, entertainment and related design fields.”

As part of the new partnership, Leica Geosystems is supplying SCI-Arc with over $200K of technology donations, including easy-to-use LiDAR scanners like the Leica BLK360— a laser scanner that captures photorealistic 3D scans of areas, structures and objects — and the Leica BLK2GO — a handheld mobile scanner that can capture structures and complete layouts anywhere. Leica Geosystems will also sponsor a sizable sum in scholarships for postgraduate students in the EDGE program, which focuses on expanding the frontiers of architecture.

John Cooper for ‘Views of Planet City.’

Leica Geosystems’ laser scanning experts will actively share their deep knowledge and experience with the students, guiding them as they integrate these advanced solutions into their design workflows. Students are currently experimenting with Leica Geosystems scanners to capture point cloud scans at the SCI-Arc campus and the SCI-Arc AltaSea incubator in San Pedro. Rather than relying on photogrammetry — which can force users to sacrifice accuracy — students can generate LiDAR scans to develop custom software for automating building design. From there, they can generate 2D site plans and build 3D models from text.

Students and researchers at SCI-Arc are already using Leica Geosystems technology in creative and forward-looking projects as well, beginning with the multi-year research and art exhibition, Views of Planet City.

Views of Planet City: Urban Foraging

Developed within the Getty Foundation’s cultural initiative “PST ART: Art and Science Collide,” Planet City examines what the world could look like if half the Earth were reserved for nature, and the 10 billion remaining humans retreated into a single megalopolis. To help design that incredible city, artist and SCI-Arc faculty John Cooper pioneered a new architectural look using “foraging” techniques to show what a city built around need, using only existing structures and materials, might look like.

Angelica Lorenzi for ‘Views of Planet City.’

Cooper’s project within the exhibit, titled Planet City Spoils, offered a new aesthetic created from structures found around Los Angeles. Rather than digitally building 3D assets — which would have been prohibitively time-consuming — his team deployed a BLK2GO scanner at chosen locations to capture a building’s structural make-up and materials. Each LiDAR scan was then added to a “shadow archive,” where artists could disassemble and reassemble scans to build digital and physical models using their chosen tools (including Cloud Compare, Rhino, Blender and Unreal Engine).

Views of Planet City: Scanning the Wildernes

While the Planet City megapolis offers an original look at a possible urban future, it also gives us a glimpse at what the rest of the world might look like untouched by human influence. In the associated multimedia project, Feral Planet, SCI-Arc faculty and artist Angelica Lorenzi set out to capture LiDAR scans of some of the most remote places in the world. Those scans then became the basis for a series of short films that dramatized the process of rewilding the uninhabited wilderness.

Lorenzi and a team of students traveled to the rocky coastal region of Piedra Blanca, California; the glacial mountains of Haines, Alaska; the densely forested high desert of McCoin Orchard, Oregon; and the UNESCO World Heritage Site of Monte Alban, Oaxaca. At each location they deployed a BLK360 to capture vegetation, geographic elements and the topography of each site. From there, the scans were uploaded and edited within Unreal Engine to create richly textured 3D assets, including animated models.

The Views of Planet City exhibit opened to the public in September 2024 and appeared at the Pacific Design Center Gallery through January 26, 2025. It remains on view at the SCI-Arc Gallery until February 16.

Angelica Lorenzi for ‘Views of Planet City.’

“The postgraduate programs at SCI-Arc EDGE broaden what an architect is capable of doing in the world by developing new knowledge and expertise,” said SCI-Arc postgraduate programs chair David Ruy. “Despite competing predictions about the future, direct experience with emerging technologies has always been the best crystal ball. I am thrilled to engage in this partnership and can’t emphasize enough how significant this relationship will be for our students and faculty.”

For more information, visit leica-geosystems.com.

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Christiane Ribeiro Appointed as Global Head of Communications at Siemens https://www.engineering.com/christiane-ribeiro-appointed-as-global-head-of-communications-at-siemens/ Mon, 24 Feb 2025 09:27:56 +0000 https://www.engineering.com/?p=137002 Christiane Ribeiro is currently head of CEO communications, strategic messaging and thought leadership.

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MUNICH, Germany, Feb 24, 2025 – Siemens AG has appointed Christiane Ribeiro Guimarães Höfer (47) as the new global head of communications at Siemens AG. She will report to Roland Busch, president and CEO of Siemens AG, effective Mar 1. Ribeiro succeeds Lynette Jackson, who has held the role since Oct 2021 and has decided to leave the company to pursue a new opportunity.

“I would like to thank Lynette for her strong contribution to Siemens, protecting and building our reputation and leading the function across the enterprise for the last three and a half years. I wish her personally and professionally all the best,” said Roland Busch, president and CEO of Siemens AG.

“We are very pleased to appoint Christiane Ribeiro as Siemens’ new global head of communications,” said Roland Busch. “Having been with Siemens for almost 25 years, she brings a deep understanding of our company, our culture, and our global footprint. Her leadership across multiple regions and her pivotal role in positioning Siemens as a leading technology company over the last years make her uniquely suited for this role. As we continue to transform and shape the industries of the future, her expertise and passion will be invaluable in strengthening our brand and engaging stakeholders around the world.”

“Together with my colleagues, I look forward to supporting the continued growth of Siemens through high-impact communications. It is a privilege to tell the amazing stories of our customers and partners, our people, and the impact our technology has on the world. I am excited to do this with outstanding teams around the globe,” said Christiane Ribeiro. 

Christiane Ribeiro is currently head of CEO communications, strategic messaging and thought leadership. She also leads communications for the newly launched “ONE Tech Company”, a company program for accelerated growth. She joined Siemens Brazil in 2001 and has held roles including head of communications and government relations for Siemens Australia and New Zealand, head of innovation communications and communications business partner to Roland Busch as chief technology officer and deputy CEO.

For more information, visit siemens.com.

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Advancing Digital Simulated Quantum Computing with DeepSeek https://www.engineering.com/advancing-digital-simulated-quantum-computing-with-deepseek/ Mon, 24 Feb 2025 09:17:44 +0000 https://www.engineering.com/?p=136999 HOLO's DeepSeek model introduces the Quantum Tensor Network Neural Network.

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SHENZHEN, China, Feb 24, 2025 – MicroCloud Hologram Inc. announced that the introduction of the DeepSeek model has improved digital simulated quantum computing. This breakthrough not only enhances the simulation efficiency of quantum computing but also provides new insights for the design and optimization of future quantum algorithms. Especially in the context where hardware implementation is not yet mature, digital simulated quantum computing has become an important tool for researching and developing quantum algorithms.

Quantum computing utilizes the superposition and entanglement properties of quantum bits (qubits) to achieve exponential speedup in computation for certain specific problems. However, the hardware implementation of quantum computers still faces numerous technical challenges, such as qubit stability and error rate control. As a result, digital simulated quantum computing has become an important tool for researching and developing quantum algorithms.

Digital simulated quantum computing uses classical computers to simulate the behavior of quantum systems, helping researchers understand and design quantum algorithms. However, as the scale of quantum systems increases, the computational resources required for simulation grow exponentially, making it extremely difficult to simulate large-scale quantum systems. HOLO, through the DeepSeek model, focuses on optimizing the simulation and prediction of complex systems. Its powerful computational optimization capabilities and flexible architecture make it an ideal tool for optimizing digital simulated quantum computing.

The state of a quantum system can be described by a wave function, which is a complex vector that exists in Hilbert space. For a system containing n qubits, the size of its wave function is 2^n, which makes directly simulating large-scale quantum systems extremely difficult.

To reduce the computational resources required for simulating quantum systems, the Tensor Network method has been introduced. Tensor networks effectively reduce computational complexity by decomposing high-dimensional tensors into products of lower-dimensional tensors. However, traditional tensor network methods still face challenges when dealing with large-scale quantum systems. HOLO, using the DeepSeek model and deep learning technology, has optimized the construction and updating process of tensor networks. By leveraging neural networks in the DeepSeek model to automatically learn the structure and parameters of the tensor network, it significantly reduces the consumption of computational resources while ensuring simulation accuracy.

HOLO, through the DeepSeek model, has developed a new type of neural network architecture called the “Quantum Tensor Network Neural Network” (QTNNN). QTNNN consists of multiple layers, each containing several quantum tensor nodes. These nodes are interconnected in a specific manner to form a complex network structure.

The training process of the DeepSeek model is divided into two stages: pre-training and fine-tuning. In the pre-training phase, the model is trained using a large amount of quantum system data to learn the basic structure and parameters of the tensor network. In the fine-tuning phase, the model is optimized for specific quantum systems, further improving the simulation’s accuracy and efficiency.

By introducing the DeepSeek model, HOLO has optimized the algorithms for digital simulated quantum computing. The optimized algorithm significantly reduces the computational resources required. Through the automatic learning of tensor network structures and parameters, the computational resources needed for simulating quantum systems are greatly reduced. Experiments show that the optimized algorithm reduces the consumption of computational resources by more than 50% when handling large-scale quantum systems.

In addition, the accuracy of digital simulation for quantum computing has been significantly improved through optimization. HOLO, utilizing the DeepSeek model’s deep learning technology, is able to capture the behavior of quantum systems more accurately. Experiments show that the optimized algorithm has enhanced simulation precision by over 30%, especially when handling complex quantum systems, where its performance is particularly remarkable.

The breakthrough achieved by HOLO through the introduction of the DeepSeek model in the field of digital simulation quantum computing marks a significant step in the deep integration of quantum computing research and deep learning technology. This breakthrough not only addresses the bottleneck issues of traditional digital simulation methods in terms of computational resources and efficiency but also provides entirely new tools and ideas for the design and optimization of quantum algorithms. With the implementation of this technology, researchers are able to simulate large-scale quantum systems more efficiently, thereby accelerating research in fields such as quantum chemistry, quantum machine learning, and quantum optimization algorithms. The successful application of this technology not only demonstrates the enormous potential of deep learning in scientific computing but also lays a solid foundation for the practical applications of future quantum computing. As quantum computing hardware continues to mature, the optimization of digital simulation technology will provide strong theoretical support and algorithmic reserves, propelling quantum computing from the laboratory into industrial applications.

From a technical implementation perspective, HOLO utilizes the DeepSeek model and its unique Quantum Tensor Network Neural Network (QTNNN) architecture to successfully integrate deep learning with quantum system simulation. This architecture not only automatically learns the complex structure and dynamic behavior of quantum systems but also significantly reduces computational resource consumption while maintaining simulation accuracy. Experimental results show that the optimized algorithm reduced computational resource consumption by over 50% and improved simulation accuracy by more than 30% when handling large-scale quantum systems. This dual enhancement in efficiency and accuracy allows researchers to verify and optimize quantum algorithms more quickly, thereby accelerating the practical application of quantum computing technology.

The technological breakthrough achieved by HOLO is not only of significant importance in the field of quantum computing but will also have a profound impact on scientific research and industrial applications. In scientific research, the optimized digital simulation technology will provide more powerful tools for fields such as quantum chemistry, materials science, and drug development, helping scientists gain a deeper understanding of the behavior of complex quantum systems. In industrial applications, the accelerated development of quantum computing will bring new opportunities to industries like finance, energy, and artificial intelligence, such as more efficient financial modeling, more precise energy optimization algorithms, and more powerful machine learning models. This will promote global scientific collaboration and innovation, accelerating the widespread adoption and application of the technology. It is foreseeable that as quantum computing technology continues to mature and optimize, human society will usher in a technological revolution driven by quantum computing.

For more information, visit ir.mcholo.com.

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Lucid Promotes Emad Dlala to Powertrain Sr VP https://www.engineering.com/lucid-promotes-emad-dlala-to-powertrain-sr-vp/ Mon, 24 Feb 2025 09:06:04 +0000 https://www.engineering.com/?p=136995 Dlala has been with Lucid since 2015, developing technologies for the Lucid Air and Gravity.

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NEWARK, CA, Feb 24, 2025 – Lucid Group, Inc. announced that Emad Dlala has been promoted to senior vice president of Powertrain, effective immediately. In this role, Emad will continue to be responsible for powertrain development and powertrain engineering, including drive units, power electronics and batteries as well as Lucid’s efficiency and charging strategy. He previously served as vice president of Powertrain.

Emad Dlala

“Since joining the company almost a decade ago, Emad has been instrumental in the development and advancement of Lucid’s powertrain technology,” said Peter Rawlinson, CEO and CTO of Lucid Motors. “This promotion reflects his exceptional leadership, dedication, and technical contributions, which have been highly influential to our widely accepted powertrain technology leadership.”

Dlala has been with Lucid in various technical roles since 2015 where he’s led efforts to develop breakthrough technologies that achieved unmatched range and performance in the Lucid Air and leading technologies in the Lucid Gravity. He brings more than two decades of engineering experience to his current leadership role. Prior to Lucid, he worked as a senior application engineer at ANSYS Inc. developing cutting-edge, computer-based engineering simulation technologies.

Dlala holds a PhD and M.Sc. in Electrical Engineering from Aalto University, Finland, and a B.Sc. in Electrical Engineering from Al-Zawiya University, Libya. 

For more information, visit lucidmotors.com.

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Nota AI Expands IoT, Edge Computing with Qualcomm https://www.engineering.com/nota-ai-expands-iot-edge-computing-with-qualcomm/ Mon, 24 Feb 2025 08:58:50 +0000 https://www.engineering.com/?p=136991 NetsPresso optimizes AI models on Qualcomm processors via AI Hub.

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SEOUL, South Korea, Feb 24, 2025 – Nota AI, a company focused on on-device AI optimization, is expanding its presence in IoT and edge computing through a collaboration with Qualcomm Technologies, Inc. This partnership supports developments in industrial safety and transportation.

Nota AI Accelerates Global Expansion in AI and IoT Markets.

NetsPresso: Revolutionizing AI Optimization

Nota AI’s flagship platform, NetsPresso, now supports the Qualcomm AI Hub. The Qualcomm AI Hub is an AI platform that provides optimized AI models and specific guidelines, enabling not only developers but also anyone to easily and quickly develop on-device AI applications. With the Qualcomm AI Hub already supporting over 150 models, NetsPresso’s new integration capabilities complement and enhance its offerings by introducing NetsPresso’s advanced optimization capabilities, particularly for resource-constrained devices.

Through its four-step process—training, compression, compilation, and benchmarking—NetsPresso optimizes AI models for resource-limited devices. Compilation and benchmarking, previously managed by NetsPresso, can now be handled within Qualcomm Technologies’ ecosystem, enhancing efficiency and enabling NetsPresso to focus on training and compression for improved overall optimization.

Nota AI CEO Myungsu Chae remarked, “Adding support for the Qualcomm AI Hub to NetsPresso has unlocked new potential for on-device AI optimization. Together, we are expanding efforts to bring On-device AI to realization on a global scale.”

Expanding Global Reach

Nota AI has announced that it earned dual ‘A’ ratings in the technical evaluation process, a key milestone toward its planned IPO on the KOSDAQ in 2025. Building on these results, the company intends to accelerate its listing procedures in the coming year. The company is expanding into key markets across the Middle East and Southeast Asia, leveraging established entities in the U.S. and Germany. Its Vision-Language Model project with Dubai’s Roads and Transport Authority (RTA) demonstrates its technological leadership, positioning the Middle East as a critical hub for future growth.

With relentless innovation and bold new initiatives, Nota AI is not only redefining AI accessibility but also setting new benchmarks in IoT and edge computing on a global scale.

For more information, visit nota.ai.

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UMEX Selects Nemetschek’s Cloud-Based dTwin Platform https://www.engineering.com/umex-selects-nemetscheks-cloud-based-dtwin-platform/ Fri, 21 Feb 2025 15:46:49 +0000 https://www.engineering.com/?p=136976 to create a digital twin of its Constanța port.

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MUNICH, Germany, Feb 21, 2025 – Romanian operator UMEX uses the Nemetschek Group’s cloud-based dTwin platform to create a digital twin of its port infrastructure in Constanța, integrating real-time data on berths, storage areas, and warehouses with key metrics on productivity, warehouse utilization, operating volume, loading efficiency, building structure, and energy consumption to support efficient port operations. This enables the entire ship unloading process to be comprehensively monitored. Energy efficiency and productivity are sustainably increased, which also benefits customers.

Large volumes of goods from neighboring countries are handled via Constanța on the Romanian Black Sea coast. UMEX operates five berths there for bulk and liquid goods, as well as bagged cargoes and general cargoes like steel products, timber or project cargo. Open spaces, warehouses and a specialized infrastructure ensure that UMEX can cover all of its customers’ freight needs.

From BIM model to digital twin

Constantly growing freight volumes and many complex activities running in parallel required UMEX to optimize its loading and unloading operations and make them more efficient. In addition, UMEX was looking to offer innovative solutions that could not be found in a traditional port terminal.

To get a clear overview of data-driven metrics such as handling volumes, productivity, warehouse utilization and loading efficiency, as well as personnel, equipment and energy costs, the UMEX team had already been using state-of-the-art technologies such as monitoring platforms for some time and also created BIM models of its warehouses. However, some of the heterogeneous data was only available on site or via various online platforms.

dTwin as a “single source of truth”

The company was looking for a solution that would integrate all visualizations of the complex – from BIM models to panoramic images – as well as data from different platforms in a digital twin. Nemetschek partner ALLBIM.NET presented UMEX with the cloud-based SaaS platform dTwin from Nemetschek. This enabled port buildings and infrastructure such as cranes to be precisely visualized in 3D in the context of the port environment. Real-time data from IoT sensors was also integrated. This created a digital twin for visual analyses, simulations and optimizations.

Only by combining building and system information with real-time data from building operations can digital twins unfold their full potential. As a “single source of truth”, dTwin brings this information together clearly on a central platform and enables a 360-degree view of the port facility’s buildings and infrastructure.

“The development of the strategy, the setup and the fine-tuning of the platform to our needs were carried out in close cooperation with the dTwin team and went smoothly,” says Daniel Nistorescu, project and investment manager at UMEX, praising the support provided by the dTwin team.

The platform provides management with a clear picture of the entire operating process at all times in order to improve energy efficiency and productivity. Anomalies and deviations are visualized at-a-glance, using heat maps.

“With dTwin, we can analyze running costs almost in real time. This makes it possible to optimize solutions and tariffs for our customers so that they can optimally discharge or load their cargo,” adds Cristian Taranu, general manager of UMEX.

UMEX integration with the digital twin ready in short time

Using the plant’s BIM model and IoT systems, UMEX developed an operational digital twin within a week, with further adjustments and fine-tuning completed over the next two months.

“Together with the UMEX team, we were able to develop tailor-made solutions in dTwin that directly address the specific challenges of our customer,” says Dr. Jimmy Abualdenien, head of digital twin product at the Nemetschek Group.

UMEX is integrating new port cranes and expanding the system to other terminals. The platform supports additional sensors and systems, providing management and departments with real-time data on depot and facility productivity. This enhances efficiency and helps optimize operations.

For more information, visit nemetschek.com.

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Renesas Introduces RA4L1 MCUs with Low Power, Touch, and Security https://www.engineering.com/renesas-introduces-ra4l1-mcus-with-low-power-touch-and-security/ Fri, 21 Feb 2025 15:30:26 +0000 https://www.engineering.com/?p=136973 New devices are ideal for metering, IoT sensing, smart locks and HMI applications.

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TOKYO, Japan, Feb 21, 2025 – Renesas Electronics Corp. introduced the RA4L1 microcontroller (MCU) group, including 14 new devices with ultra-low power consumption, advanced security features and segment LCD support. Powered by an 80-MHz Arm Cortex-M33 processor with TrustZone support, the new MCUs offer a balance of performance, features, and power efficiency for applications such as water meters, smart locks, and IoT sensors.

MCUs with segment LCD and advanced security for battery-powered applications

The RA4L1 MCUs employ proprietary low-power technology that delivers 168 µA/MHz active mode @ 80 MHz and standby current of just 1.70 µA with all the SRAM retained. They are available in compact packages, including a 3.64 x 4.28 mm Wafer-Level Chip-Scale Package (WLCSP), suitable for portable printers, digital cameras, and smart labels.

The RA4L1 MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and TrustZone support as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. The FSP eases migration of existing IP to and from either RA6 or RA2 Series devices.

Renesas RA Family MCU Portfolio

“Renesas’ RA2L1 Group MCUs have seen remarkable market success since their launch in 2020, addressing a diverse range of low-power applications requiring capacitive touch. Built on the same low-power technology, the RA4L1 Group is our response to customers who require the unique combination of ultra-low power with better CPU performance, segment LCD support and advanced security,” said Daryl Khoo, vice president of embedded processing marketing division at Renesas.

Key features of the RA4L1 MCUs:

  • Core: 80 MHz Arm Cortex-M33 with TrustZone
  • Memory: 256-512 KB Dual-Bank Flash, 64 KB SRAM, 8 KB Dataflash
  • Peripherals: Segment LCD, Capacitive Touch, USB-FS, CAN FD, low-power UART, SCI, SPI, QSPI, I2C, I3C, SSI, ADC, DAC, Comparator, low-power timer, real-time clock 
  • Packages: 3.64 x 4.28 mm WLCSP72, 7 x 7 mm LQFP48, 10 x 10 mm LQFP64, 14 x 14 mm LQFP100, 5.5 x 5.5 mm BGA64, 7 x 7 mm BGA100
  • Security: Unique ID, RSIP security engine supporting TRNG, AES, ECC, Hash
  • Wide Ambient Temperature Range: Ta = -40º to +125º C for the QFN, QFP and CSP package options; Ta = -40º to +105º C for the BGA package option

Availability

The RA4L1 MCUs are available now, along with the FSP software. Renesas is also shipping an RA4L1 Evaluation Board and an RA4L1 Capacitive Touch Renesas Solution Starter Kit (RSSK). More information is available at renesas.com/RA4L1. Samples and kits can be ordered either on the Renesas website or through distributors.

Renesas MCU leadership

A world leader in MCUs, Renesas ships more than 3.5 billion units per year, with approximately 50% of shipments serving the automotive industry, and the remainder supporting industrial and Internet of Things applications as well as data center and communications infrastructure. Renesas has the broadest portfolio of 8-, 16- and 32-bit devices, delivering unmatched quality and efficiency with exceptional performance. As a trusted supplier, Renesas has decades of experience designing smart, secure MCUs, backed by a dual-source production model, the industry’s most advanced MCU process technology and a vast network of more than 250 ecosystem partners.

For more information about Renesas MCUs, visit renesas.com/MCUs.

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3Shape Launches New CAD Workflows for Dental Labs https://www.engineering.com/3shape-launches-new-cad-workflows-for-dental-labs/ Fri, 21 Feb 2025 14:53:22 +0000 https://www.engineering.com/?p=136951 3Shape adds a free AI-driven crown design and workflow innovations to Dental System 2024.

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COPENHAGEN, Denmark, Feb 21, 2025 – This year at LMT Lab Day, 3Shape marks 25 years by introducing new advancements in CAD workflows for dental labs.

3Shape will soon be adding a free and fully integrated AI-driven crown design application and several workflow innovations to its 3Shape Dental System 2024 software to significantly enhance efficiency and digitization for dental labs.

“As the very first employee hired at 3Shape 25 years ago, I’ve witnessed CAD/CAM evolve from a bold vision into the industry standard. The rapid adoption of digital workflows by both labs and practices has been remarkable. That’s why lab technicians need to experience the speed, automation, and convenience of our new Dental System 2024 software,” says Rune Fisker, senior vice president of product strategy at 3Shape.

At today’s LMT Lab Day and the upcoming IDS in Germany, 3Shape will introduce several new and innovative upgrades to its 3Shape Dental System software for labs that include integrated and free AI-driven design automation, faster case management, 3Shape LMS software updates and workflow integration, TruAbutment ioConnect partnership, and seamless cloud-based licensing.

Key Highlights for 3Shape Dental System 2024:

1. AI Powered Design Proposals – Now Free with 3Shape LabCare*           

  • Labs will receive high-quality AI-powered editable design proposals for crowns, inlays, and onlays direct from 3Shape Automate when opening cases or desktop scanning. The integrated workflow requires no manual setup.
  • AI design proposals are included free with a 3Shape LabCare subscription to maximize productivity for dental labs.

2. Enhanced efficiency with new Dental System 2024 software           

  • Ensure quicker turnaround times with up to 10x faster case management.
  • Improve productivity with up to 20x faster reopening of cases.
  • Free up time with AI-powered automation for routine tasks such as occlusal plane positioning, segmentation, and annotation placement.
  • Eliminate common design issues with Automated scan alignment and correction tools.
  • Streamline design processes and reduce manual adjustments post-production with new sculpt tools for RPD teeth.

 3. New integrations for 3Shape LMS           

  • 3Shape LMS and Dental System now integrated to streamline every task – reduces admin work and double data entry between the two solutions. **
  • 3Shape LMS delivers true digital customer experience – 3Shape LMS integration with 3Shape Unite Cloud for dental practices enables labs to collaborate and communicate with their clients via the cloud. The integration additionally provides the lab’s clients with a transparent overview of their cases 24/7. ***  

4. TRIOS ioConnect Workflow for All-on-X Treatments

Labs can now take advantage of 3Shape’s seamless TRIOS ioConnect Workflow for All-on-X full arch restoration cases. This innovative collaboration integrates the power of TruAbutment’s ioConnect elongated abutments with 3Shape’s Dental System software and TRIOS intraoral scanners, providing dental labs with an efficient solution for designing All-on-X treatments. ****

3Shape also expects to soon release a Straumann TRIOS workflow with Straumann’s new exact scan bodies for full-arch digital workflow cases as well.

5. Cloud Licensing: Freedom from Physical Dongles

3Shape is eliminating its physical software license dongles and moving instead to a cloud-based licensing system. The cloud license will connect to the 3Shape Account and provide labs with a clear overview of all their purchased software.

Having the software license on the cloud will also simplify software updating and ensure labs always benefit from the latest functionality and improvements.

Experience the Future of Digital Dentistry

Dental System 2024 marks a new era in digital dentistry by providing labs with enhanced speed, automation, and convenience. With AI-driven efficiency, intelligent integrations, and software innovations, this latest release ensures that dental lab professionals can focus on what matters most-delivering exceptional service to their customers.

For more information, visit 3shape.com.

*First available in select countries from April 2025. Available only to 3Shape LabCare subscribers on Dental System 24.1.1 or newer. Fair use limit applies. If limit is exceeded, additional AI designs can be purchased using CAD points. AI design proposals are only available for TRIOS, integrated 3rd party IOS, and 3Shape desktop scans.

**Planned rollout: March 2025. This integration follows the global availability of 3Shape LMS, which is currently supported in English-speaking countries, including the United States, Canada, United Kingdom, Denmark, Sweden, Norway, Finland, Belgium, Netherlands, and Luxembourg.

*** Available Q2 2025

**** Available March 2025

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Bridgestone Selects VI-grade’s Dynamic Simulator https://www.engineering.com/bridgestone-selects-vi-grades-dynamic-simulator/ Fri, 21 Feb 2025 10:20:48 +0000 https://www.engineering.com/?p=136947 Bridgestone integrates VI-grade’s simulator with existing AI and simulation technologies for virtualized tire-vehicle interaction.

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UDINE, Italy, Feb 21, 2025 – VI-grade announced that Bridgestone has invested in VI-grade’s dynamic driving simulator. The new simulator will be installed at Bridgestone’s EMEA R&D Centre near Rome, Italy, enhancing their virtual tire development (VTD) capabilities and enabling a more sustainable and efficient approach to tire innovation.

With this investment, Bridgestone aims to scale up its ability to virtually design, test, and validate tires using advanced simulation and AI technologies. By combining VI-grade’s high-fidelity simulator with its existing simulation and AI technologies, Bridgestone can simulate complex tire-vehicle interactions adopting a fully virtualized process. This approach accelerates time-to-market, saves physical prototypes and improves collaboration with OEMs by enabling simultaneous tire and vehicle development through iterative virtual testing. Additionally, the new simulator will empower Bridgestone to achieve its sustainability goals by reducing physical testing and material waste. The company projects that up to 12,000 experimental tires will be saved annually, contributing to a substantial reduction in CO2 emissions and raw material consumption.

“This investment in our internal driver-in-the-loop simulation capabilities is a major milestone as we build a comprehensive ecosystem for accurately predicting tire performance in the virtual world. It also gives us the capabilities to experiment with new and innovative combinations of designs and materials in a fully virtual environment,” says Emilio Tiberio, chief technology officer Bridgestone West.

“Bridgestone’s investment in the state-of-the-art dynamic driving simulator reflects the trust that global industry leaders place in our simulation solutions,” added Guido Bairati, managing director at VI-grade. “Widely recognized as the industry standard and used extensively by OEMs and Tier 1 suppliers worldwide, our state-of-the-art dynamic driving simulator is the perfect tool for Bridgestone to enhance their virtual tire development capabilities, reduce time to market, and achieve their ambitious sustainability goals.”

For further information, please visit vi-grade.com.

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Radiance Technologies Partners with Flynn Advisors https://www.engineering.com/radiance-technologies-partners-with-flynn-advisors/ Fri, 21 Feb 2025 10:20:31 +0000 https://www.engineering.com/?p=136941 This partnership aims to strengthen public-private collaboration, national security, and tech development.

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HUNTSVILLE, AL, Feb 21, 2025 – Radiance Technologies has engaged Flynn Advisors LLC as a strategic consultant. General (Ret) Charles A. Flynn, the founder of Flynn Advisors LLC and a highly respected leader with four decades of distinguished service in the United States Army, will provide valuable expertise in national security, strategic risk analysis, and military modernization efforts to support Radiance Technologies’ ongoing innovation and growth.

General (Ret) Charles A. Flynn.

“General Flynn’s extensive experience in military leadership, strategic operations, and national security will be invaluable as we continue to push the boundaries of technology and solutions that enhance U.S. defense capabilities,” said Radiance Technologies CEO Bill Bailey. “His deep understanding of both military and civilian sectors, particularly in the Indo-Pacific region, will provide critical insight as we expand our portfolio and partnerships to address complex defense challenges.”

Throughout his distinguished career, General Flynn has held key leadership roles across every echelon of the United States Army, from tactical to strategic levels His operational experience in Asia and the Indo-Pacific has been instrumental in advancing U.S. strategic interests and regional security. Throughout his service, he focused on fostering alliances and strengthening defense capabilities. General Flynn has earned a reputation for assessing complex challenges and implementing solutions that align strategic objectives with operational realities.

“Working with Radiance Technologies represents an exciting opportunity to leverage my experience to help further strengthen the private sector’s role in supporting national security priorities,” said General Flynn. “The company’s commitment to innovation and collaboration aligns with my own values, and I look forward to contributing to the development of cutting-edge solutions that safeguard critical infrastructure and advance U.S. defense initiatives.”

General Flynn’s career is marked by his leadership in joint, multinational, and Army modernization efforts, along with his dedication to mentoring and inspiring teams to deliver on mission objectives.

Flynn Advisors LLC’s partnership with Radiance Technologies will focus on enhancing public-private partnerships, advancing national security objectives, and supporting the development of advanced technologies that address the nation’s most pressing defense needs.

For more information, visit radiancetech.com.

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